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A System for Determining the Impact of Mechanical Stress on the Reliability of MEMS
Stefan Spinner
Graduiertenkolleg “Embedded Microsystems”, Universität Freiburg
This presentation reports on an experimental test system which enables the automated analysis of mechanical stress impact on the reliability of microelectromechanical systems (MEMS). With this system, in-situ electrical characterization and optical inspection are performed while subjecting MEMS devices to defined mechanical loads. With this highly flexible system reliability tests, postmanufacturing tests and stress screens can be performed on single chips as well as on whole wafers with diameters up to 6 inch.
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